Effect of Wet Chemical Pretreatment Conditions on the...

Japanese Journal of Applied Physics 2009 / 8 Vol. 48; Iss. 8

Effect of Wet Chemical Pretreatment Conditions on the Interfacial Adhesion Energy between Electroless-Plated Ni and Polyimide Films

Park, Young-Bae, Min, Kyoung-Jin, Park, Sung-Cheol, Lee, Kyu Hwan, Jeong, Yongsoo
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Volume:
48
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.1143/JJAP.48.08HL03
Date:
August, 2009
File:
PDF, 767 KB
english, 2009
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