Integration of Cu/SiOC in Cu dual damascene interconnect...

Microelectronic Engineering 2002 Vol. 64; Iss. 1-4

Integration of Cu/SiOC in Cu dual damascene interconnect for 0.1-μm technology

M Fayolle, J Torres, G Passemard, F Fusalba, G Fanget, D Louis, M Assous, O Louveau, M Rivoire, K Haxaire, M Mourier, S Maitrejean, P Besson, L Broussous, L Arnaud, H Feldis
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Volume:
64
Year:
2002
Language:
english
Pages:
8
DOI:
10.1016/s0167-9317(02)00769-4
File:
PDF, 1.51 MB
english, 2002
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