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Impact of thermal cycling on the evolution of grain, precipitate and dislocation structure in Al, 0.5% Cu, 1% Si thin films
B. Kaouache, P. Gergaud, O. Thomas, O. Bostrom, M. LegrosVolume:
70
Year:
2003
Language:
english
Pages:
8
DOI:
10.1016/s0167-9317(03)00385-x
File:
PDF, 791 KB
english, 2003