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[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Influencing factors in high precision fusion wafer bonding for monolithic integration
Uhrmann, Thomas, Kurz, Florian, Plach, Thomas, Wagenleitner, Thomas, Dragoi, Viorel, Wimplinger, Markus, Lindner, PaulYear:
2015
Language:
english
DOI:
10.1109/ECTC.2015.7159701
File:
PDF, 817 KB
english, 2015