Optimization of Cu–Ag Core–Shell...

IEEE Transactions on Components Packaging and Manufacturing Technology 2015 / 7 Vol. 5; Iss. 7

Optimization of Cu–Ag Core–Shell Solderless Interconnect Paste Technology

Kammer, Milea J., Muza, Anthony, Snyder, John, Rae, Alan, Suk Jun Kim,, Handwerker, Carol A.
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Volume:
5
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2015.2438816
Date:
July, 2015
File:
PDF, 3.73 MB
english, 2015
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