Using Wafer Map Features to Better Predict Die-Level Failures in Final Test
Kang, Seokho, Cho, Sungzoon, An, Daewoong, Rim, JaeyoungVolume:
28
Language:
english
Journal:
IEEE Transactions on Semiconductor Manufacturing
DOI:
10.1109/TSM.2015.2443864
Date:
August, 2015
File:
PDF, 935 KB
english, 2015