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Effects of NH 3 Plasma Treatment of the Substrate on Metal Organic Chemical Vapor Deposition of Copper Films
Kim, Young Suk, Jung, Donggeun, Kim, Dong Joon, Min, Suk-KiVolume:
37
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.1143/JJAP.37.L991
Date:
August, 1998
File:
PDF, 264 KB
english, 1998