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Thin and Low-Resistivity Tantalum Nitride Diffusion Barrier and Giant-Grain Copper Interconnects for Advanced ULSI Metallization
Nakao, Shin-ichi, Numata, Masashi, Ohmi, TadahiroVolume:
38
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.1143/JJAP.38.2401
Date:
April, 1999
File:
PDF, 290 KB
english, 1999