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Effects of Post-Deposition Annealing on the Copper Films Electrodeposited on the ECR Plasma Cleaned Copper Seed Layer
Lee, Hanseung, Chakrabarti, Kuntal, Lee, ChongmuVolume:
41
Journal:
Japanese Journal of Applied Physics
DOI:
10.1143/JJAP.41.7476
Date:
December, 2002
File:
PDF, 1.30 MB
2002