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Frictional and Removal Rate Studies of Silicon Dioxide and Silicon Nitride CMP Using Novel Cerium Dioxide Abrasive Slurries
Zhuang, Yun, King, Deanna, Kido, Takanori, Philipossian, AraVolume:
44
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.1143/JJAP.44.30
Date:
January, 2005
File:
PDF, 190 KB
english, 2005