Effects of Ag Thickness and Deposition Temperature on...

Japanese Journal of Applied Physics 2005 / 5 Vol. 44; Iss. 5A

Effects of Ag Thickness and Deposition Temperature on Prevention of Cu Diffusion in Cu/Ag/Si System

Yukawa, Motonobu, Kitagawa, Hiroki, Iida, Shoji
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Volume:
44
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.1143/JJAP.44.3187
Date:
May, 2005
File:
PDF, 857 KB
english, 2005
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