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A reliability comparison of electroplated and stencil printed flip-chip solder bumps based on UBM related intermetallic compound growth properties
Jing-feng Gong, P. Chan, Guo-wei Xiao, R. Lee, M. YuenYear:
2006
Language:
english
DOI:
10.1109/TCAPT.2005.853178
File:
PDF, 2.26 MB
english, 2006