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Integration and Dielectric Reliability of 30 nm Half Pitch Structures in Aurora®LK HM
S. Demuynck, C. Huffman, M. Claes, S. Suhard, J. Versluijs, H. Volders, N. Heylen, K. Kellens, K. Croes, H. Struyf, G. Vereecke, P. Verdonck, D. De Roest, J. Beynet, H. Sprey, G. P. BeyerYear:
2010
Language:
english
DOI:
10.1143/JJAP.49.04DB05
File:
PDF, 442 KB
english, 2010