Wetting Characteristics of Al-containing Sn-1Ag-0.5Cu...

Procedia Technology 2015 Vol. 20

Wetting Characteristics of Al-containing Sn-1Ag-0.5Cu Solder Alloy on Cu Substrate using Wetting Balance and Spread area Methods

Sabri, Mohd Faizul Mohd, Said, Suhana Binti Mohd, Shnawah, Dhafer Abdulameer
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
20
Year:
2015
Language:
english
Journal:
Procedia Technology
DOI:
10.1016/j.protcy.2015.07.003
File:
PDF, 475 KB
english, 2015
Conversion to is in progress
Conversion to is failed