Barrier Effects of Tungsten Infer-Layer for Aluminum...

Japanese Journal of Applied Physics 1985 / 7 Vol. 24; Iss. Part 1, No

Barrier Effects of Tungsten Infer-Layer for Aluminum Diffusion in Aluminum/Silicon Ohmic-Contact System

Hara, Tohru, Enomoto, Shuichi, Ohtsuka, Noboru, Shima, Shohei
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Volume:
24
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.1143/JJAP.24.828
Date:
July, 1985
File:
PDF, 254 KB
english, 1985
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