Stress-Induced Device Degradation Due to Die-Attachment...

Japanese Journal of Applied Physics 1999 / 4 Vol. 38; Iss. Part 1, No

Stress-Induced Device Degradation Due to Die-Attachment Process after Area Bump Formation

Shimoyama, Nobuhiro, Machida, Katsuyuki, Shimaya, Masakazu, Kyuragi, Hakaru
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Volume:
38
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.1143/JJAP.38.2262
Date:
April, 1999
File:
PDF, 462 KB
english, 1999
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