Effects of Si Addition and Heating Ar on the...

Japanese Journal of Applied Physics 2002 / 2 Vol. 41; Iss. Part 1, No

Effects of Si Addition and Heating Ar on the Electromigration Performance of Al-Alloy Interconnects

Lee, Dok Won, Lee, Byung-Zu, Jeong, Jong Yeul, Park, Hyun, Shim, Kyu Cheol, Kim, Jong Seok, Park, Young Bae, Woo, Sun-Woong, Lee, Jeong-gun
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Volume:
41
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.1143/JJAP.41.557
Date:
February, 2002
File:
PDF, 231 KB
english, 2002
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