Device Transfer Technology by Backside Etching (DTBE) for...

Japanese Journal of Applied Physics 2003 / 9 Vol. 42; Iss. Part 2, No

Device Transfer Technology by Backside Etching (DTBE) for Poly-Si Thin-Film Transistors on Glass/Plastic Substrate

Wang, Shuo-Cheng, Yeh, Ching-Fa, Huang, Chien-Kai, Dai, Yuan-Tung
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Volume:
42
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.1143/JJAP.42.L1044
Date:
September, 2003
File:
PDF, 173 KB
english, 2003
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