Analysis and optimization of TSV–TSV coupling in...

Journal of Semiconductors 2015 / 04 Vol. 36; Iss. 4

Analysis and optimization of TSV–TSV coupling in three-dimensional integrated circuits

Zhao, Yingbo, Dong, Gang, Yang, Yintang
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
36
Language:
english
Journal:
Journal of Semiconductors
DOI:
10.1088/1674-4926/36/4/045011
Date:
April, 2015
File:
PDF, 1.03 MB
english, 2015
Conversion to is in progress
Conversion to is failed