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Copper Damascene Interconnection with Tungsten Silicon Nitride Diffusion Barrier Formed by Electron Cyclotron Resonance Plasma Nitridation
Hirata, Akihiko, Machida, Katsuyuki, Awaya, Nobuyoshi, Kyuragi, Hakaru, Maeda, MasahikoVolume:
38
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.1143/JJAP.38.2355
Date:
April, 1999
File:
PDF, 604 KB
english, 1999