Copper Damascene Interconnection with Tungsten Silicon...

Copper Damascene Interconnection with Tungsten Silicon Nitride Diffusion Barrier Formed by Electron Cyclotron Resonance Plasma Nitridation

Hirata, Akihiko, Machida, Katsuyuki, Awaya, Nobuyoshi, Kyuragi, Hakaru, Maeda, Masahiko
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Volume:
38
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.1143/JJAP.38.2355
Date:
April, 1999
File:
PDF, 604 KB
english, 1999
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