Influence of Silicon Wafer Loading Ambient on Chemical...

Japanese Journal of Applied Physics 2001 / 12 Vol. 40; Iss. Part 1, No

Influence of Silicon Wafer Loading Ambient on Chemical Composition and Thickness Uniformity of Sub-5-nm-Thick Oxide Films

Endoh, Tetsuo, Kimura, Yasutaka, Lenski, Markus, Masuoka, Fujio
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Volume:
40
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.1143/JJAP.40.7023
Date:
December, 2001
File:
PDF, 106 KB
english, 2001
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