Effects of the Metallurgical Properties of Upper Cu Film on...

Japanese Journal of Applied Physics 2005 / 4 Vol. 44; Iss. 4B

Effects of the Metallurgical Properties of Upper Cu Film on Stress-Induced Voiding (SIV) in Cu Dual-Damascene Interconnects

Abe, Mari, Furutake, Naoya, Saito, Shinobu, Inoue, Naoya, Hayashi, Yoshihiro
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Volume:
44
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.1143/JJAP.44.2294
Date:
April, 2005
File:
PDF, 453 KB
english, 2005
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