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[IEEE 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Kyoto, Japan (2015.4.14-2015.4.17)] 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Impact of through-silicon via technology on energy consumption of 3D-integrated solid-state drive systems
Onagi, Takahiro, Sun, Chao, Takeuchi, KenYear:
2015
Language:
english
DOI:
10.1109/ICEP-IAAC.2015.7111027
File:
PDF, 512 KB
english, 2015