Effect of Organic Acids in Copper Chemical Mechanical...

Japanese Journal of Applied Physics 2002 / 3 Vol. 41; Iss. Part 1, No

Effect of Organic Acids in Copper Chemical Mechanical Planarization Slurry on Slurry Stability and Particle Contamination on Copper Surfaces

Eom, Dae-Hong, Park, Jin-Goo, Lee, Eung-Sug
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Volume:
41
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.1143/JJAP.41.1305
Date:
March, 2002
File:
PDF, 700 KB
english, 2002
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