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Effect of Pulse Frequency on Leveling and Resistivity of Copper Coatings
Chen, Chia-Fu, Lin, Kun-ChengVolume:
41
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.1143/JJAP.41.2881
Date:
May, 2002
File:
PDF, 997 KB
english, 2002