Diffusion Resistance of Low Temperature Chemical Vapor...

Japanese Journal of Applied Physics 2011 / 5 Vol. 50; Iss. 5

Diffusion Resistance of Low Temperature Chemical Vapor Deposition Dielectrics for Multiple Through Silicon Vias on Bumpless Wafer-on-Wafer Technology

Kitada, Hideki, Maeda, Nobuhide, Fujimoto, Koji, Mizushima, Yoriko, Nakata, Yoshihiro, Nakamura, Tomoji, Ohba, Takayuki
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
50
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.1143/JJAP.50.05ED02
Date:
May, 2011
File:
PDF, 898 KB
english, 2011
Conversion to is in progress
Conversion to is failed