3D interconnect architecture for high-bandwidth massively...

3D interconnect architecture for high-bandwidth massively paralleled imager

K. Kwiatkowski, J.C. Lyke, R.J. Wojnarowski, J.-F. Beche, R. Fillion, C. Kapusta, J. Millaud, R. Saia, M.D. Wilke
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Volume:
509
Year:
2003
Language:
english
Pages:
6
DOI:
10.1016/s0168-9002(03)01571-7
File:
PDF, 340 KB
english, 2003
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