Adapting MCM-D technology to a piezoresistive accelerometer packaging
Collado, A, Plaza, J A, Cabruja, E, Esteve, JVolume:
13
Language:
english
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/0960-1317/13/4/306
Date:
July, 2003
File:
PDF, 147 KB
english, 2003