Copper Thermal Diffusion in TaN Film on Si Substrate

Japanese Journal of Applied Physics 2002 / 11 Vol. 41; Iss. Part 1, No

Copper Thermal Diffusion in TaN Film on Si Substrate

Jiang, Lei, He, Ping, He, Guowei, Zong, Xiangfu, Lee, Chiaping
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Volume:
41
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.1143/JJAP.41.6525
Date:
November, 2002
File:
PDF, 205 KB
english, 2002
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