Effect of Molecular Weight of Surfactant in Nano Ceria Slurry on Shallow Trench Isolation Chemical Mechanical Polishing (CMP)
Kang, Hyun-Goo, Katoh, Takeo, Lee, Myung-Yoon, Park, Hyung-Soon, Paik, Ungyu, Park, Jea-GunVolume:
43
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.1143/JJAP.43.L1060
Date:
July, 2004
File:
PDF, 591 KB
english, 2004