[IEEE 2011 IEEE International 3D Systems Integration Conference (3DIC) - Osaka (2012.01.31-2012.02.2)] 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International - Low temperature through-Si via fabrication using electroless deposition
Inoue, Fumihiro, Philipsen, Harold, Radisic, Alex, Armini, Silvia, Leunissen, Peter, Miyake, Hiroshi, Arima, Ryohei, Shimizu, Tomohiro, Ito, Toshiaki, Seki, Hirofumi, Shinozaki, Yuko, Yamamoto, TomohiYear:
2012
Language:
english
DOI:
10.1109/3DIC.2012.6262984
File:
PDF, 285 KB
english, 2012