[IEEE 2015 Symposium on Design, Test, Integration and...

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[IEEE 2015 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) - Montpellier, France (2015.4.27-2015.4.30)] 2015 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) - A strain-sensor-integrated test bed for electro mechanical characterization of VLSI probe

Setoguchi, Ryota, Lebrasseur, Eric, Kubota, Masanori, Mita, Yoshio
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Year:
2015
Language:
english
DOI:
10.1109/DTIP.2015.7161037
File:
PDF, 1.44 MB
english, 2015
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