[IEEE 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Kyoto, Japan (2015.4.14-2015.4.17)] 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Advanced plating photoresist development for semiconductor packages
Sakakibara, Hirokazu, Akimaru, Hisanori, Hiro, Akito, Sato, Keiichi, Fujiwara, Koichi, Okamoto, Kenji, Kusumoto, ShiroYear:
2015
Language:
english
DOI:
10.1109/ICEP-IAAC.2015.7111090
File:
PDF, 852 KB
english, 2015