Performance of Cu Dual-Damascene Interconnects Using a Thin...

Performance of Cu Dual-Damascene Interconnects Using a Thin Ti-Based Self-Formed Barrier Layer for 28 nm Node and Beyond

Ohmori, Kazuyuki, Mori, Kenichi, Maekawa, Kazuyoshi, Kohama, Kazuyuki, Ito, Kazuhiro, Ohnishi, Takashi, Mizuno, Masao, Asai, Koyu, Murakami, Masanori, Miyatake, Hiroshi
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Volume:
49
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.1143/JJAP.49.05FD01
Date:
May, 2010
File:
PDF, 98 KB
english, 2010
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