Minimization of Residual Stress in SOI Films by Using AlN Interlaid Insulator
Ogura, Atsushi, Egami, Koji, Kimura, MasakazuVolume:
24
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.1143/JJAP.24.L669
Date:
August, 1985
File:
PDF, 147 KB
english, 1985