![](/img/cover-not-exists.png)
Characterization of Si Wafer Bonding by Injection-Dependent Recombination Velocity
Grivickas, V., Thungström, G., Bikbajevas, V., Linnros, J., Noreika, D.Volume:
34
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.1143/JJAP.34.L806
Date:
July, 1995
File:
PDF, 455 KB
english, 1995