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Thermal Imprint Lithography onto Filler Incorporated Composite Resin
Lee, Sangmoon, Kwak, Jungbok, Oh, Yongsoo, Lee, Hwan-SooVolume:
48
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.1143/JJAP.48.06FH16
Date:
June, 2009
File:
PDF, 650 KB
english, 2009