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Challenges of high-robustness self-assembly with Cu/Sn-Ag microbump bonding for die-to-wafer 3D integration
T. Suzuki, K. Asami, Y. Kitamura, T. Fukushima, C. Nagai, J. Bea, Y. Sato, M. Murugesan, K. Lee, M. KoyanagiYear:
2015
Language:
english
DOI:
10.1109/ECTC.2015.7159615
File:
PDF, 1.23 MB
english, 2015