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Adhesion and interface chemical reactions of Cu/polyimide and Cu/TiN by XPS
Won-Jun Lee, Youn-Seoung Lee, Sa-Kyun Rha, Yoon-Jik Lee, Kwan-Yong Lim, Yong-Duck Chung, Chung-Nam WhangVolume:
205
Year:
2003
Language:
english
Pages:
9
DOI:
10.1016/s0169-4332(02)01016-4
File:
PDF, 381 KB
english, 2003