Thin Film Packaging atmosphere management by solder reflow...

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Thin Film Packaging atmosphere management by solder reflow sealing

J. Pornin, D. Saint-patrice, B. Reig, J. Bielen, G. Henn, M. Giesen, S. Fanget
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Year:
2015
Language:
english
DOI:
10.1109/ECTC.2015.7159769
File:
PDF, 1.29 MB
english, 2015
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