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Mechanical Property Control of Low-kDielectrics for Diminishing Chemical Mechanical Polishing (CMP)-Related Defects in Cu-Damascene Interconnects
K. Hijioka, F. Ito, M. Tagami, H. Ohtake, Y. Harada, T. Takeuchi, S. Saito, Y. HayashiYear:
2004
Language:
english
DOI:
10.1143/JJAP.43.1807
File:
PDF, 276 KB
english, 2004