Integration of Self-Assembled Porous Silica in Low-k/Cu Damascene Interconnects
S. Chikaki, M. Shimoyama, R. Yagi, Y. Shishida, T. Yoshino, T. Ono, N. Fujii, N. Hata, T. Nakayama, Y. Sonoda, Y. Seino, K. Kinoshita, T. KikkawaAnnée:
2009
Langue:
english
DOI:
10.1143/JJAP.48.095002
Fichier:
PDF, 699 KB
english, 2009