Gap-filling of Cu Employing Sustained Self-Sputtering with...

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Gap-filling of Cu Employing Sustained Self-Sputtering with Inductively Coupled Plasma Ionization

T. Ichiki, T. Kikuchi, A. Sano, S. Shingubara, Y. Horiike
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Year:
1997
DOI:
10.1143/JJAP.36.1469
File:
PDF, 1.63 MB
1997
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