Reactive Ion Etching Mechanism of Copper Film in...

Japanese Journal of Applied Physics 1997 / 1 Vol. 36; Iss. Part 1, No

Reactive Ion Etching Mechanism of Copper Film in Chlorine-based Electron Cyclotron Resonance Plasma

Lee, Sung-Kwon, Chun, Sung-Soon, Hwang, ChanYong, Lee, Won-Jong
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Volume:
36
Journal:
Japanese Journal of Applied Physics
DOI:
10.1143/JJAP.36.50
Date:
January, 1997
File:
PDF, 962 KB
1997
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