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Thin Copper Seed Layers in Interconnect Metallization Using the Electroless Plating Process
Meen, Teen-Hang, Chen, Wen Ray, Huang, Chien-Jung, Chiu, Chih-JenVolume:
43
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.1143/JJAP.43.5100
Date:
August, 2004
File:
PDF, 283 KB
english, 2004