Resistivity of Thin Copper Interconnection Layers

Japanese Journal of Applied Physics 2005 / 3 Vol. 44; Iss. No. 13

Resistivity of Thin Copper Interconnection Layers

Hara, Tohru, Shimura, Yasu, Namiki, Ken
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Volume:
44
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.1143/JJAP.44.L408
Date:
March, 2005
File:
PDF, 168 KB
english, 2005
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