Novel Air-gap Formation Technology Using Ru Barrier Metal...

Japanese Journal of Applied Physics 2011 / 1 Vol. 50

Novel Air-gap Formation Technology Using Ru Barrier Metal for Cu Interconnects with High Reliability and Low Capacitance

Takigawa, Yukio, Tarumi, Nobuaki, Shiohara, Morio, Soda, Eiichi, Oda, Noriaki, Ogawa, Shinichi
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Volume:
50
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.1143/JJAP.50.016503
Date:
January, 2011
File:
PDF, 507 KB
english, 2011
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