Thermal Stability Enhancement of Cu Interconnects by...

Japanese Journal of Applied Physics 2001 / 4 Vol. 40; Iss. Part 1, No

Thermal Stability Enhancement of Cu Interconnects by Employing a Self-aligned MgO Layer Obtained From a Cu(Mg) Alloy Film

Lee, Wonhee, Cho, Heunglyul, Cho, Bumseok, Yang, Hee-Jung, Kim, Jiyoung, Kim, Yong-Suk, Jung, Woo-Gwang, Kwon, Hoon, Lee, Jinhyung, Reucroft, P. J., Lee, Chongmu, Lee, Eungu, Lee, Jaegab
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Volume:
40
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.1143/jjap.40.2408
Date:
April, 2001
File:
PDF, 374 KB
english, 2001
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