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[IEEE 2014 Electronics System-Integration Technology Conference (ESTC) - Helsinki, Finland (2014.9.16-2014.9.18)] Proceedings of the 5th Electronics System-integration Technology Conference (ESTC) - Three-tier chips stack with TSVs for backside illuminated image sensor/ADC/ISP
Chang, H. H., Hsiao, Z. C., Chien, C. H., Zhan, C. J., Hsin, Y. C., Tzeng, P. J., Chen, T. S., Ko, C. T., Lo, W. C., Kao, M. J.Year:
2014
Language:
english
DOI:
10.1109/ESTC.2014.6962709
File:
PDF, 1.51 MB
english, 2014