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[IEEE 2014 Electronics System-Integration Technology Conference (ESTC) - Helsinki, Finland (2014.9.16-2014.9.18)] Proceedings of the 5th Electronics System-integration Technology Conference (ESTC) - Investigation of electromigration behaviour in lead-free flip-chip solders connections
Dohle, Rainer, Gorywoda, Marek, Wirth, Andreas, Gosler, JorgYear:
2014
Language:
english
DOI:
10.1109/ESTC.2014.6962757
File:
PDF, 1.54 MB
english, 2014